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WebMemory circuitry 920 may be implemented as one or more of solder down packaged integrated circuits, single die package (SDP), dual die package (DDP) or quad die package (Q17P), socketed memory modules, dual inline memory modules (DIMMs) including microDIMMs or MiniDIMMs, and/or soldered onto a motherboard via a ball grid array (BGA). The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) on which it is placed. In a BGA the pins are replaced by … See more A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more … See more Lack of compliance A disadvantage of BGAs is that the solder balls cannot flex in the way that longer leads can, so they are not mechanically compliant. As with all surface mount devices, bending due to a difference in coefficient of thermal expansion See more Primary end-users of BGAs are original equipment manufacturers (OEMs). There is also a market among electronic hobbyists do it yourself (DIY) such as the increasingly popular See more • PBGA Package Information from Amkor Technology • PBGA Package Information from J-Devices Corporation See more High density The BGA is a solution to the problem of producing a miniature package for an integrated circuit … See more • CABGA: chip array ball grid array • CBGA and PBGA denote the ceramic or plastic substrate material to which the array is attached. See more • Dual in-line package (DIP) • Pin grid array (PGA) • Land grid array (LGA) • Thin quad flat pack (TQFP) • Small-outline integrated circuit (SOIC) See more WebThe author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, ... reach da hood script pastebin